Rohm Semiconductor Electronic Components Datasheet

BD22621G-M

0.3A Current Limit High Side Switch ICs



BD22621G-M Datasheet PDF
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Datasheet
1 Channel Compact High Side Switch ICs
0.3A Current Limit High Side Switch ICs
BD22621G-M
General Description
BD22621G-M is a low on-resistance N-channel
MOSFET high-side power switch, optimized for
Universal Serial Bus (USB) applications. BD22621G-M
is equipped with the function of over-current detection,
thermal shutdown, under-voltage lockout and soft-start.
Key Specifications
Input Voltage Range:
ON-Resistance:
Over-Current Threshold:
Standby Current:
Operating Temperature Range:
2.7V to 5.5V
120mΩ(Typ)
0.3A(Typ)
0.01μA (Typ)
-40°C to +105°C
Features
AEC-Q100 Qualified(Note1)
Over Current Threshold: 0.3A
Built-in Low ON-Resistance (Typ 120mΩ)
N-Channel MOSFET
Reverse Current Protection when
Power Switch Off
Thermal Shutdown
Under-Voltage Lockout
Open-Drain Error Flag Output
Output Discharge Function
Soft Start Circuit
Control Input Logic : Active-High
(Note1: Grade2)
Package
W(Typ) x D(Typ) x H(Max)
SSOP5
2.90mm x 2.80mm x 1.25mm
Applications
Car accessory, Industrial applications
Typical Application Circuit
5V (Typ)
3.3V
10kΩ to
100kΩ
CIN
IN
GND
EN
OUT
/OC
+
CL
-
Lineup
Over-Current Threshold
Min Typ Max
0.18A
0.3A
0.42A
Control Input
Logic
High
Package
Orderable Part Number
SSOP5
Reel of 3000 BD22621G-MTR
Product structureSilicon monolithic integrated circuit
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BD22621G-M
Block Diagram
IN
EN
OUT
Pin Configurations
TOP VIEW
1 IN
2 GND
3 EN
OUT 5
/OC 4
Pin Description
Pin No.
1
2
3
4
5
Symbol
IN
GND
EN
/OC
OUT
I/O Function
- Switch input and supply voltage for the IC.
- Ground.
I
Enable input.
EN: High level input turns on the switch.
Over-current detection pin.
O Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
O Switch output.
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BD22621G-M
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
IN Supply Voltage
VIN -0.3 to +6.0
V
EN Input Voltage
VEN -0.3 to +6.0
V
/OC Voltage
V/OC
-0.3 to +6.0
V
/OC Sink Current
I/OC 5 mA
OUT Voltage
VOUT
-0.3 to +6.0
V
Storage Temperature
Tstg -55 to +150
°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Thermal Resistance(Note1)
Parameter
Symbol
Thermal Resistance (Typ)
1s(Note3)
2s2p(Note4)
Unit
SSOP5
Junction to Ambient
Junction to Top Characterization Parameter(Note2)
θJA 376.5
ΨJT 40
185.4
30
°C/W
°C/W
(Note1)Based on JESD51-2A(Still-Air)
(Note2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note3)Using a PCB board based on JESD51-3.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Footprints and Traces
Thickness
70μm
(Note4)Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
4 Layers
FR-4
Top
Copper Pattern
Footprints and Traces
Thickness
70μm
Board Size
114.3mm x 76.2mm x 1.6mmt
2 Internal Layers
Bottom
Copper Pattern
74.2mm2 (Square)
Thickness Copper Pattern Thickness
35μm 74.2mm2(Square)
70μm
Recommended Operating Conditions (Tj= -40°C to +105°C)
Parameter
Symbol
Min
Rating
Typ
IN Operating Voltage
VIN 2.7 5.0
Continuous Current
IOMAX
-
-
Max
5.5
200
Unit
V
mA
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BD22621G-M
Electrical Characteristics
(VIN= 5V, Tj= -40 to +105°C, unless otherwise specified.)
DC Characteristics
Parameter
Symbol
Min
Limit
Typ
Operating Current
IDD - 135
Standby Current
EN Input Voltage
EN Input Leakage
ISTB
VENH
VENL
VENL
IEN
- 0.01
2.0 -
--
--
-1 +0.01
- 120
ON-Resistance
- 120
RON
- 140
Reverse Leak Current
Over-Current Threshold
Short Circuit Output Current
Output Discharge Resistance
/OC Output Low Voltage
UVLO Threshold
IREV
ITH
ISC
RDISC
V/OC
VTUVH
VTUVL
- 140
--
180 300
170 290
90 200
15 60
--
2.1 2.3
2.0 2.2
Max
200
5
-
0.8
0.6
+1
165
250
190
270
1.0
420
410
325
165
0.4
2.5
2.4
Unit Conditions
μA
VEN = 5V
VOUT = open
μA
VEN = 0V
VOUT = open
V High Input, VIN=3.3 to 5V
V Low Input, VIN=5V
V Low Input, VIN=3.3V
μA VEN = 0V or 5V
VIN=5V, IOUT = 100mA
Tj= 25°C
VIN=5V, IOUT = 100mA
mΩ Tj= -40°C to +105°C
VIN=3.3V, IOUT = 100mA
Tj= 25°C
VIN=3.3V, IOUT = 100mA
Tj= -40°C to +105°C
μA VOUT = 5.0V, VIN = 0V
VIN = 5V
mA
VIN = 3.3V
mA VIN=3.3 to 5V, VOUT = 0V, RMS
Ω IDISC = 1mA
V I/OC = 0.5mA
V VIN Increasing
V VIN Decreasing
AC Characteristics
Parameter
Output Rise Time
Output Turn ON Time
Output Fall Time
Output Turn OFF Time
/OC Delay Time
Symbol
Min
Limit
Typ
Max
Unit
Conditions
tON1 - 1 6 ms
tON2
tOFF1
tOFF2
-
-
1.5
1
10
20
ms
μs
RL = 500Ω
- 3 40 μs
t/OC 9 15 21 ms
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BD22621G-M
Measurement Circuit
V IN
A
1µF
IN
GND
VEN
EN
OUT
/O C
A. Operating Current, Standby Current
V IN
A
1µF
IN
GND
VEN
EN
OUT
RL
/O C
B. EN Input Voltage, Output Rise / Fall Time
V IN
A
1µF
IN
GND
VEN
EN
10kΩ
OUT
IO U T
/O C
V IN
A
1µF
IN
GND
VEN
EN
OUT
/O C
C. ON-Resistance, Over-Current Detection
D. /OC Output Low Voltage
Timing Diagram
Figure 1. Measurement Circuit
I/O C
VEN
VENH
tON2
VOUT
90%
10%
tON1
VENL
tOFF2
90%
10%
tOFF1
Figure 2. Output Rise / Fall Time
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BD22621G-M
Typical Performance Curves
160
140
Ta=105°C
120
Ta=25°C
100
80
Ta=-40°C
60
40
20
0
23456
Supply Voltage : VIN[V]
Figure 3. Operating Current vs Supply Voltage
(EN Enable)
160
140
120
VIN=5.5V VIN=5V
100
80
60 VIN=2.7V
40
20
0
-50
-25 0 25 50 75 100
Ambient Temperature: Ta[°C]
125
Figure 4. Operating Current vs Ambient
Temperature
(EN Enable)
0.40
0.35
0.30
0.25
0.20
0.15
0.10 Ta=105°C
0.05
0.00
2
Ta=85°C
345
Supply Voltage : VIN[V]
6
Figure 5. Standby Current vs Supply Voltage
(EN Disable)
0.40
0.35
0.30
0.25
0.20
0.15
0.10
VIN=2.7V
VIN=5V
VIN=5.5V
0.05
0.00
-50
-25 0 25 50 75 100 125
Ambient Temperature : Ta[°C]
Figure 6. Standby Current vs Ambient Temperature
(EN Disable)
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BD22621G-M
Typical Performance Curves
3.0
2.5
2.0
Low to High
1.5
1.0 High to Low
0.5
0.0
2
Ta=25°C
345
Supply Voltage : VIN[V]
Figure 7. EN Input Voltage vs Supply
Voltage
(VENH, VENL)
6
3.0
2.5
2.0
Low to High
1.5
High to Low
1.0
0.5
0.0
-50
VIN=5V
-25 0 25 50 75 100 125
Ambient Temperature : Ta[°C]
Figure 8. EN Input Voltage vs Ambient
Temperature
(VENH, VENL)
250 250
200
Ta=105°C
200
150
Ta=25°C
150
100 Ta=-40°C 100
50 50
VIN=2.7V
VIN=5V
VIN=5.5V
0
2
345
Supply Voltage : VIN[V]
6
Figure 9. ON-Resistance vs Supply Voltage
0
-50
-25 0 25 50 75 100 125
Ambient Temperature : Ta[°C]
Figure 10. ON-Resistance vs Ambient Temperature
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BD22621G-M
Typical Performance Curves - continued
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
2
Ta=105°C
Ta=25°C
Ta=-40°C
345
Supply Voltage: VIN[V]
Figure 11. Over-Current Threshold vs
Supply Voltage
6
0.50
0.45
0.40
0.35
VIN=5V
VIN=5.5V
0.30
0.25
0.20
VIN=2.7V
0.15
0.10
-50
-25 0 25 50 75 100
Ambient Temperature: Ta[°C]
125
Figure 12. Over-Current Threshold vs
Ambient Temperature
200 200
Ta=105°C
150 Ta=25°C
100
50 Ta=-40°C
0
2
345
Supply Voltage: VIN[V]
6
Figure 13. Output Discharge Resistance vs
Supply Voltage
150
VIN=2.7V
100
VIN=5V
50
VIN=5.5V
0
-50
-25 0 25 50 75 100
Ambient Temperature: Ta[°C]
125
Figure 14. Output Discharge Resistance vs
Ambient Temperature
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BD22621G-M
Typical Performance Curves - continued
100
80 Ta=105°C
Ta=25°C
60
40
Ta=-40°C
20
100
80
VIN=2.7V
60
VIN=5V
40
VIN=5.5V
20
0
2
345
Supply Voltage : VIN[V]
Figure 15. /OC Output Low Voltage vs
Supply Voltage
6
0
-50
-25 0 25 50 75 100 125
Ambient Temperature : Ta[°C]
Figure 16. /OC Output Low Voltage vs
Ambient Temperature
2.5 0.4
2.4
2.3 VTUVH
2.2
VTUVL
2.1
0.3
0.2
0.1
2.0
-50
-25 0 25 50 75 100
Ambient Temperature: Ta[°C]
125
Figure 17. UVLO Threshold Voltage vs
Ambient Temperature
0.0
-50
-25 0 25 50 75 100
Ambient Temperature: Ta[°C]
125
Figure 18. UVLO Hysteresis Voltage vs
Ambient Temperature
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BD22621G-M
Typical Performance Curves - continued
5.0
4.0
3.0
Ta=-40°C
2.0 Ta=25°C
1.0
0.0
2
Ta=105°C
345
Supply Voltage: VIN[V]
Figure 19. Output Rise Time vs
Supply Voltage
5.0
4.0
3.0
2.0 VIN=5.5V VIN=5V
1.0
VIN=2.7V
V
0.0
6 -50 -25 0 25 50 75 100 125
Ambient Temperature: Ta[°C]
Figure 20. Output Rise Time vs
Ambient Temperature
5.0 5.0
4.0 4.0
3.0 Ta=-40°C
3.0
VIN=5.5V
Ta=25°C
VIN=5V
2.0 2.0
1.0 Ta=105°C
1.0
VIN=2.7V
0.0
2
345
Supply Voltage: VIN[V]
0.0
6 -50 -25 0 25 50 75 100 125
Ambient Temperature: Ta[°C]
Figure 21. Output Turn-On Time vs
Supply Voltage
Figure 22. Output Turn-On Time vs
Ambient Temperature
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BD22621G-M
Typical Performance Curves - continued
5.0 5.0
4.0 4.0
3.0
Ta=-40°C
2.0
Ta=25°C
1.0
Ta=105°C
0.0
2
345
Supply Voltage: VIN[V]
Figure 23. Output Fall Time vs Supply
Voltage
6
3.0
VIN=2.7V
2.0 VIN=5.5V
VIN=5V
1.0
0.0
-50
-25 0 25 50 75 100
Ambient Temperature: Ta[°C]
125
Figure 24. Output Fall Time vs
Ambient Temperature
6.0
Ta=-40°C
5.0
Ta=25°C
4.0
3.0
Ta=105°C
2.0
1.0
0.0
2
345
Supply Voltage: VIN[V]
Figure 25. Output Turn-Off Time vs
Supply Voltage
6.0
VIN=5.5V
5.0 VIN=5V
4.0
3.0 VIN=2.7V
2.0
1.0
0.0
6 -50 -25 0 25 50 75 100 125
Ambient Temperature: Ta[°C]
Figure 26. Output Turn-Off Time vs
Ambient Temperature
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BD22621G-M
Typical Performance Curves - continued
20
18 Ta=-40°C
Ta=105°C
16
Ta=25°C
14
12
10
2
345
Supply Voltage: VIN[V]
Figure 27. /OC Delay Time vs
Supply Voltage
20
18
VIN=2.7V
16 VIN=5V
14
VIN=5.5V
12
10
6 -50 -25 0 25 50 75 100 125
Ambient Temperature: Ta[°C]
Figure 28. /OC Delay Time vs Ambient
Temperature
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BD22621G-M
Typical Wave Forms
(Ta=25°C, unless otherwise specified)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(10mA/div.)
VIN=5V
RL=50
TIME(1ms/div.)
Figure 29. Output Rise Characteristic
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(10mA/div.)
VIN=5V
RL=50
TIME(1μs/div.)
Figure 30. Output Fall Characteristic
VEN
(5V/div.)
V/OC
(5V/div.)
CL=100μF
CL=47μF
IOUT
(100mA/div.)
CL=22μF
VIN=5V
RL=50Ω
TIME (1ms/div.)
Figure 31. Inrush Current Response
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
VIN=5V
TIME (5ms/div.)
Figure 32. Over-Current Response
Ramped Load
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BD22621G-M
Typical Wave Forms continued
(Ta=25°C, unless otherwise specified)
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
VIN=5V
TIME (5ms/div.)
Figure 33. Over-Current Response
Enable to Short Circuit
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.2A/div.)
VIN=5V
TIME (2s/div.)
Figure 34. Over-Current Response
Enable to Short Circuit
VOUT
(5V/div.)
V/OC
(5V/div.)
VIN
(5V/div.)
VOUT
(5V/div.)
IOUT
(1A/div.)
VIN=5V
TIME (5ms/div.)
Figure 35. Over-Current Response
1Ω Load Connected to VOUT
IOUT
(10mA/div.)
RL=50
TIME (10ms/div.)
Figure 36. UVLO Response when
Increasing VIN
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BD22621G-M
Typical Wave Forms continued
(Ta=25°C, unless otherwise specified)
VIN
(5V/div.)
VOUT
(5V/div.)
IOUT
(10mA/div.)
RL=50
TIME (10ms/div.)
Figure 37. UVLO Response when
Decreasing VIN
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BD22621G-M
Typical Application Circuit
C o n tro lle r
10k Ω to
100kΩ
C IN
5V (Typ)
IN
GND
EN
OUT
/O C
+
CL
-
Application Information
When excessive current flows due to output short-circuit, ringing occurs because of the inductance between power source
line and the IC. IN pin functions as both the power supply of the internal circuit of the IC and input of power switch. Therefore,
ringing of power line may cause adverse effects on IC operations. In order to avoid this, it is recommended to connect a low
ESR bypass capacitor (1μF or higher) between IN and GND pin which should be placed as close to these pins as possible.
Additionally, in order to decrease voltage fluctuations from power source line to IC, connect a low ESR capacitor in parallel
with CIN. 10μF to 100μF or higher is effective.
Pull up /OC output using 10kΩ to 100kΩ resistor values.
The value of CL should be chosen to satisfy the intended application.
This system connection diagram does not guarantee operation as the intended application.
When using the circuit with changes to the external circuit values, make sure to leave an adequate margin for external
components taking into consideration the DC and transient characteristics as well as the design tolerance of the IC.
Functional Description
1. Switch Operation
IN pin and OUT pin are connected to the drain and the source of switch MOSFET respectively. The IN pin is also used as
power source input to internal control circuit.
When the switch is turned ON from EN control input, the IN and OUT pins are connected by a 120mΩ (Typ) switch. In ON
status, the switch is bidirectional. Therefore, when the potential of OUT pin is higher than that of IN pin, current flows from
OUT to IN pin. On the other hand, when the switch is turned off, it is possible to prevent current from flowing reversely
from OUT to IN pin since a parasitic diode between the drain and the source of switch MOSFET is not present.
2. Thermal Shutdown Circuit (TSD)
In the event of continuous over-current condition, the temperature of the IC would increase drastically. If the junction
temperature goes beyond 165°C (Typ) due to over-current detection, thermal shutdown circuit operates and turns power
switch off, and the IC outputs a fault flag (/OC). Then, when the junction temperature decreases lower than 145°C (Typ),
the power switch is turned on and fault flag (/OC) is cancelled. This operation repeats, unless the cause of the increase of
chip’s temperature is removed or the output of power switch is turned OFF.
The thermal shutdown circuit operates when the switch is ON (EN signal is active).
3. Over-Current Detection (OCD)
The over-current detection circuit limits current (ISC) and outputs fault flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. The over-current detection circuit works when the switch is on (EN signal is active).
There are three types of response against over-current:
(1) When the switch is turned on while the output is in short circuit status, the switch goes into current limit status
immediately.
(2) When the output short-circuits or high capacity load is connected while the switch is on, very large current
flows until the over-current limit circuit reacts. When the current detection and limit circuit operates, current
limitation is carried out.
(3) When the output current increases gradually, current limitation would not operate unless the output current
exceeds the over-current detection value. When it exceeds the detection value, current limitation is carried out.
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BD22621G-M
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V (Typ). If VIN drops below 2.2V (Typ) while the
switch is still ON, then UVLO shuts off the power switch. UVLO has a hysteresis of 100mV (Typ).
Under-voltage lockout circuit operates when the switch is on (EN signal is active).
5. Fault Flag (/OC) Output
Fault flag output is an N-MOS open drain output. During detection of over-current and/or thermal shutdown, the output
level will turn low.
Over-current detection has delay filter. This delay filter prevents current detection flags from being sent during
instantaneous events such as inrush current at switch on or during hot plug. If fault flag output is unused, /OC pin should
be connected to open or ground line.
6. Output Discharge Function
When the switch is turned off by disabling control input or UVLO function, the 60Ω(Typ.) discharge circuit between OUT
and GND turns on which discharges the electric charge of the capacitive load. However, if the voltage of IN declines
rapidly, then the OUT pin becomes Hi-Z without UVLO function.
Over-Current
Detection
VOUT
Over-Current
Load Removed
ITH
IOUT
ISC
V/OC
t/OC
Figure 38. Over-Current Detection
VEN
VOUT
IO U T
V /O C
O u tp u t S h o rt C ircu it
T h e rm a l S h u td o w n
/O C D e la y Tim e
Figure 39. Over-Current Detection, Thermal Shutdown Timing
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BD22621G-M
I/O Equivalent Circuit
Symbol
Pin No.
EN 3
Equivalent Circuit
EN
OUT
5
/OC 4
OUT
/O C
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BD22621G-M
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the ICs power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
The amount of heat generated depends on the On-state resistance and Output current.
Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature
increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this
specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application
and allow sufficient margins in the thermal design.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
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BD22621G-M
Operational Notes continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin A
Pin B
C
B
E
Pin B
P+
NN
Parasitic
Elements
P P+
NN
P Substrate
GND
Parasitic
Elements
N P+
N P N P+ N
P Substrate
Parasitic
GND GND
Elements
Figure 40. Example of monolithic IC structure
B
N Region
close-by
C
E
Parasitic
Elements
GND
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls
below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD22621G-M
Ordering Information
B D 2 2 6 2 1 G - MTR
Part Number
BD22621G
Package
G: SSOP5
Product Rank
M: for Automotive
Packaging and forming specification
TR: Embossed tape and reel
Marking Diagram
Part Number Marking
SSOP5 (TOP VIEW)
Part Number
BD22621G-M
LOT Number
Part Number Marking
XT
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BD22621G-M
Physical Dimension, Tape and Reel Information
Package Name
SSOP5
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BD22621G-M
Revision History
Date
2.Nov.2016
Revision
001
New Release
Changes
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Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHMs Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU CHINA
CLASS
CLASS
CLASS
CLASSb
CLASS
CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
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Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE
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